Product description
High-power amplifier modules with integrated heat sinks offer advantages like high heat dissipation efficiency, stable performance, and strong reliability:
• High Heat Dissipation Efficiency: The heat sink dissipates heat directly into the air or works with external heatsinks to accelerate heat conduction and dissipation. Some modules use metal fins to significantly improve dissipation, preventing performance degradation during high-power operation. Top-side cooling designs allow heat to reach the heatsink without passing through the PCB, markedly reducing thermal resistance and enabling higher power output in limited spaces.
• Stable Performance: High-power modules generate significant heat. Inadequate dissipation causes temperature rise, leading to performance decline. The heat sink maintains temperature within a reasonable range, ensuring stable gain, low noise figure, and other performance metrics, guaranteeing accurate and stable signal amplification while reducing distortion and interference.
• Enhanced Reliability: Overheating is a major cause of electronic component failure. The integrated heat sink effectively reduces the risk of damage to internal components from high temperatures, extends module lifespan, lowers failure probability, and improves overall system reliability, especially for applications requiring long-term stable operation like communication base stations and industrial control systems.
• Increased Power Output Capability: Capable of 5W per fiber output. Effective heat dissipation allows operation at higher power levels without thermal limitations.
• Strong Environmental Adaptability: The heat sink enables stable operation across a wider temperature range, typically -20°C to +60°C.
• Space and Cost Savings: The integrated heat sink design allows for a more compact module structure, often eliminating the need for complex external cooling systems, saving space and cost. Some modules use insulated substrates like Ceramic Copper Clad Laminate, allowing multiple modules to share a single heatsink, further simplifying system thermal design and reducing costs.
Product Applications
● Fiber opticl sensing
● Control panel optical communication system
● Nonlinear optics research
Product Parameters
|
Parameters |
Min |
Typ |
Max |
Unit |
||
|
Wavelength Coverage |
1540 |
- |
1565 |
nm | ||
|
Number of Channels |
1 |
|||||
|
Input Power |
-10 |
- |
+10 |
dBm |
||
|
Output Power |
23 |
- |
37 |
dBm |
||
|
Noise Finger |
- |
5.5 |
6 |
dB | ||
|
Open Pump Threshold |
- |
-12 |
- |
dBm |
||
|
High Temperature Shutdown Threshold |
- |
65 |
- |
℃ |
||
|
Return Loss |
45 |
- |
- |
dB |
||
|
Polarization-Dependent gain |
- |
0.5 |
dB |
|||
|
Working Temperature |
-5 |
- |
+55 |
°C |
||
|
Storage Temperature |
-40 |
- |
85 |
°C |
||
|
Relative Humidity (non-condensation) |
5 |
- |
85 |
% |
||
|
Size |
140*140*29 |
mm |
||||
|
Power Consumption |
30 |
W |
||||
|
Supply Voltage |
4.75 |
5 |
5.25 |
V |
||
|
Communication Level |
LVTTL/RS232 |
|||||
Data Test Curve

Product Size

Product Drdering Guide

- EYDFA-S-C-055-140*140*29-37/xx-0.9-FC/APC-1-white pine casingEYDFA: Erbium ytterbium co-doped fiber amplifierS: single channelC:C wave band055: Product model140*140*29: external dimensions37/xx: The saturated output optical power is 37dBm0.9: Input/output fiber type SMF-28e,900umFC/APC: Type of fiber optic connector1: Input and output fiber length 1mWhite loose tube: fiber optic tail fiber tube type

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